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Disco's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while disco's new resinoid blade for package singulation can significantly improve process quality The singulation of these arrays into individual packages is an important step in the manufacturing process, and as in many cases, needs to be optimised to minimise the overall cost of the package. Qfn/mlp substrates behave much differently from most known materials in the microelectronics industry, and therefore present challenges for the dicing process

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This paper will cover basic substrate characteristics and various singulation topics including Such individualization of a wafer to multiple chips is called singulation, and a process of sawing a wafer plate into a single cuboid is called die sawing. Substrate geometry and material characteristics, substrate design and parameters affecting the cut quality, quality specifications to which.

Saw singulation is the most challenging process to meet both quality and cost targets

Clear trend shows the reduction in package size and continuous tightening of cut quality specifications Conventional package sawing or singulation process uses a mechanical blade to cut through the metal and mold material according to defined package size of the product fig Singulation of individual unit from the encapsulated leadframe strip Conventional package singulation technique comes with some process/assembly related rejections

It covers various aspects such as types of blade assemblies, process flow, saw blade characteristics, cut quality definitions, process controls, and common defects along with their causes and corrective actions Saw singulation characterization on high pr ofile multi chip module packages with thick leadframe nazrul anuar, amalina taib stats chippac malaysia sdn Clear trend shows the reduction in package size and continuous tightening of cut quality specifications.